Nokia, STMicroelectronics close deal in 3G chipset development

Nokia and Swiss-based STMicroelectronics have closed a deal to deepen their collaboration on the licensing and supply of integrated circuit designs and modem technologies for 3G and its evolution.

The multifaceted agreement transfers a core part of Nokia’s Integrated Circuit (IC) operations to STMicroelectronics and positions ST to design and manufacture 3G chipsets based on Nokia’s modem technologies, energy management and RF (radio frequency) technology and to deliver complete solutions to Nokia and the open market.

The agreement includes the transfer of 185 highly-skilled engineers and other Nokia personnel in Finland and UK to STMicroelectronics. The transfer has been subject to a personnel consultation process required by local regulations.

As part of the arrangement, Nokia has awarded ST a design win of an advanced 3G HSPA (high-speed packet access) chipset supporting high data rates.

This design win represents the first complete 3G chipset for STMicroelectronics which is a global leader in developing and delivering semiconductor solutions across the spectrum of microelectronics applications.

An unrivalled combination of silicon and system expertise, manufacturing strength, Intellectual Property (IP) portfolio and strategic partners positions the company at the forefront of System-on-Chip (SoC) technology and its products play a key role in enabling today’s convergence markets.